Need Hybrid Assembly Capability or Capacity?             

Hari, LLC can provide your needs in "Local Advantage"

• Reduced cost as compared to offshore manufacturing;
• Quick turns, Engineering Prototypes;
• Small and medium production runs processed economically; and
• Markets served RF, Microwave, and Optics.

Hybrid Assembly Capabilities Include:

• Die attach:  AuSn, AuSi, Epoxy;
• Substrate attach:  AuGe, AuSn, Epoxy;
• Wire bonding:  Au wedge and ball, 0.7 mil and up;
• Ribbon attach:  Au ribbon; and
• RF Test, Bond-pull tests, Kitting, Plating of chip components, Top-level assembly.

For more details, please contact Planar Monolithics Industries at (916) 542-1401 or simply email us at This e-mail address is being protected from spambots. You need JavaScript enabled to view it.